三菱化学代理,Post Cu/Low-k CMP Cleaning Solution, "MCX-SDR4",三菱化学株式会社

Product Details

Product Name Post Cu/Low-k CMP Cleaning Solution, "MCX-SDR4"
Generic Product Name Advanced Cleaning Solutions
Company Name Mitsubishi Chemical Corporation
Department Name Semiconductor Materials Dept., Information & Electronics Div., Advanced Solutions
TEL +81-3-6748-7168
Product Information During the post CMP cleaning process in semiconductor manufacturing, it is important to remove organic residues and particles on Cu wires and Low-k films without damaging the substrate. Our product, MCX-SDR4, is a high-efficiency cleaning solution suited for semiconductor industries. Characteristics: -High efficiency particle removal -Removes organic residues effectively -Limits galvanic corrosion on Cu wire -Limits Low-k damage -Improves Low-k wetting properties
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Product Family (middle & small classification)

middle classification small classification
Specialty Chemicals Detergents and Antifouling Agents
Electronic and Electrical Components and Products Electronics Materials and Components
Other Related Products for Electric and Electronic Devices

Applications

IT
Ubiquitous network
Cleaning after Cu CMP (slurry polishing) process