NEBNext Ultra II 末端修复/加 dA 尾模块
概述
The NEBNext Ultra II End Repair/dA-Tailing Module has been optimized to convert 500 pg-1 μg of fragmented DNA to repaired DNA having 5′ phosphorylated, 3′ dA-tailed ends. The module is optimized for use with the NEBNext Ultra II Ligation Module (NEB #E7595), and is part of the Ultra II DNA workflow which enables high yield preparation of high quality libraries from 500 pg to 1 µg of
input DNA.
This module is compatible with Illumina workflows and with some Oxford Nanopore MinION™ workflows.
For Illumina library construction, the NEBNext Ultra II End Repair/dA-Tailing Module is designed for use with the following:
• NEBNext Ultra II Ligation Module (NEB #E7595)
• NEBNext Ultra II Q5® Master Mix (NEB #M0544)
• NEBNext Oligos for Illumina(NEB #E7335, #E7500, #E7710, #E7730, #E6609, #E7600 #E7535,
#E7350)
NEBNext Ultra II 末端修复/加 dA 尾模块组份
NEBNext Ultra II End Prep Enzyme Mix
NEBNext Ultra II End Prep Reaction Buffer
贮存温度
-20°C
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